Full Automatic solder paste Printer YSL-120

Features

1.Perfect solution for large size product printing

2.Simple calibration and maintenance

3.Stable printing quality

4.Independent developed image processing software

Overall diagram

1.Machine housing module

2.CCD image capture module

3.Stencil lifting module of Z-axis

4.Squeegee printing module

5.Cleaning module

6.Platform fine adjustment module

7.Rail and conveyor module

8.Three color warning lamp

9.Display and input device

Technical parameters

ParameterYSL-120Basic ParametersScreen Frame Size(mm)1000(×)×300(Y)-1500(×)×650(Y)Thickness∶ 20-40mmMin PCB(mm)80(×)×50(Y)mmMax PCB(mm)1200(X)×360(Y)Thickness0.2mm～6mm( Use jig when pcb less than 0.4mm)Curve<1%(Diagonal measurement)PCB backside Part Height15mmConveyor height900±40mmSupportMagnetic support,Magnetic piece,Vacuum chamber(Option)ClampSide clamp(Standard),please read the option tableEdge distancePCB process edge ≥2.5mm without PCB edge(Option)Conveyor speed0~1500mm/sec,increment 1mmConveyor beltU type beltStopper methodAir cylinderStopper positionSet the PCB stopper position according to the size of boardSet by softwareSoftware SettingsPrint SystemPrint speed5-200mm/s adjustablePrint headStep motor drive scraper liftingScraperSteel scraper,rubber scraper(option)Scraper angle60°Scraper pressure0~20kgView SystemSubstrate SeparationThree-section Substrate Separation；Speed∶0.1-20mm/s；Distance∶0-20mmAlignment position methodMark Automatic aligningCameraGermany BASLER,1/3”CCD,640*480pixel,pixel size 5.6μmx5.6μmAcquire image methodUpper/under double photoCamera lightCoaxial light,Ring light four kinds light can adjustableView range9mm*7mmMark dimensionsDiameter or Side length 1mm~2mm,allowable offset 10%Mark shapeCir,Rec,or rhombus etcMark positionPCB dedicated mark or PCB pad2D detectionStandardAccuracyTable adjusting rangeX=±10mm,Y=±10mm,0=±1.5°Positional accuracy±0.01mmPrinting accuracy±0.025mmTimeCycle time<10s(ex print,cleaning time)Convert line time<5minProgramming time<10minControl SystemComputer configurationIndustrial PC,Windows official systemSystem languageChinese /EnglishPre and next machine connectionSMEMAUser authorizationUser PW and Senior PW setCleaning SystemCleaning systemDry and Wet,vacuum modelLiquid level detectionLiquid level auto alarm detectionPower ParametersMain power supplyAC220V±10%50/60HZ Single phaseTotal powerAbout 3kwMain air supply4.5～6kgf/cm2Machine weightAbout 1500KgMachine dimensions2350(L)×1350(W)×1590(H)mmOptionPneumatic top clampStandardTop clamp + side clampFor PCB(thickness≤1mm)Vacuum adsorption and cleanFor PCB(thickness≤1mm)and FPCAuto tin added/Auto loading and unloading/Flexible and universal supportFor the Double-sided PCB(PCB backside parts Height ≤9mm)Automatic positioning of screen frame/PCB board thickness movement adjustment functionStandardSqueegee pressure feedback function/Air conditionCustomer can buy by themselvesThe rest of solder paste on the stencil monitoring systemT/SPI close loopSPI close loopUPS power off protectionUPS 15 min power off protectionIndustry 4.0Bar code trace function,Production analysis,etc